X-Ray Systems Use 'Teach And Replay' For Repeatable Inspection Procedures

A new data sheet from leading manufacturer of X-ray systems for the electronics industry, Dage Precision Industries, graphically illustrates the inspection applications the company's equipment addresses in the PCB assembly arena. Examples show, among other capabilities, how the systems provide highly magnified angled views of the otherwise hidden interconnections to flip chips, chip scale packages and BGAs.

The new data sheet also highlights the systems' software which enables inspection procedures to be simply taught and subsequently replayed, thereby providing the operator with more time for analysis without compromising sample throughput.

Traditionally, the setting-up and subsequent use of repeatable inspection positions for samples, whether for 100% inspection or for batch sampling, have been difficult to achieve with X-ray systems, particularly when angled views have been required. Dage's software overcomes these difficulties and enables a new pattern of analysis locations and required views to be set up simply by moving to each desired position on the master sample and pressing a record button. Once completed, the pattern can be replayed as often as necessary.

The software, which comes as standard with Dage's XL6000, XL6500 and XL7000 X-ray inspection systems, provides full system control, including sample movement, data analysis and data output. As well as providing a host of image manipulation and enhancement functions, the software also includes a point-to-point measurement capability which enables the user to rapidly check BGA ball pitch and ball diameters. Should voids be present within balls, the software will calculate the percentage voiding of each ball and display the results in either red (fail) or green (pass) numerals according to the threshold chosen by the operator.