What do we mean by UFP, Ultra Fine Pitch?
A UFP is used to define a bond pad pitch ( distance between the center of 2 adjacent bond pads on a silicon chip) of less than 50 microns. Sometimes the term "small geometry" is also used.
A UFP is used to define a bond pad pitch ( distance between the center of 2 adjacent bond pads on a silicon chip) of less than 50 microns. Sometimes the term "small geometry" is also used.