TECHNICAL PAPERS: Bondtesters

Dage have published a number of Technical Papers - please click to download a full copy of your selected article.

1) The Challenge Of Testing Ultra Fine Pitch Wire Bonds [view pdf] (245.0K)

2) A New Way Of Shear Testing Gold Ball Bonds [view pdf] (98.1K)

3) Pull Testing Of Solder Balls On BGA and CSP Packages Without Reflow [view pdf] (212.5K)

4) Ball Bond Shear Testing [view pdf] (69.2K)

5) Bond Testing Bumped Devices - please click here to view this article which appears in the June 2004 issue of Advanced Packaging magazine

6) Predicting Brittle Fracture Failures - published in SMT magazine Sepember 2005 - [view pdf]

7) Lead-free BGA Reliability - High-Speed Bondtesting and Brittle Fracture Detection - please click here to view a pdf of this article which appeared in the October 2005 issue of Global SMT and Packaging magazine

8) Brittle Fracture Mechanism Paper given at ECTC 2007 [View pdf]

9) High Speed Solder Ball Shear and Pull Tests vs Board Level Mechanical Drop Tests [View pdf) 

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