DAGE 4000W Bondtester

A modified DAGE 4000 is interfaced with an industry standard wafer handler for automatic loading from the cassette, bump testing (shear or pull), and then unloading of the 6 or 8 inch wafers. This offers significant advantages:

  • Overcomes the need for manual handling of expensive bumped wafers
  • Overcomes the need for operator control of loadtool to bump alignment
  • Increased throughput of bump testing

KEY FEATURES

  • Semi-automatic handling of wafers from cassette to bondtester
  • Semi-automatic bump shear testing
  • Semi-automatic transfer of tested wafer back to cassette
  • Wafer orientation and safety interlocks
  • Automatic cassette scan to check location of wafers and the presence of any cross slotted wafers
  • Automated bump shear routines (no camera system needed)
  • 240mm joystick controlled precision XY stage