BONDTESTERS

DIE SHEAR TEST

Die shear testing is a means of evaluating the strength of attachment of silicon dies to their substrates. The test is similar to solder bump shear in that a chisel-like tool is used to push against the die in th Y-axis of the bond test. Several factors are important in correct execution of the test:

1. die shear tool width to match die size in order to apply a uniform load
2. travel of shear tool parallel to X-Y plane of die; i.e. shear tool is perpendicular to die
3. parallel alighment of shear tool and die edge
4. load application to high accuracy (better than +/- 5% or 50g, whichever is greater)
5. high load range
6. good optics for correct alignment of shear tool and die

The DAGE 4000 bondtester using a suitable workholder and loadcell meets or exceeds these requirements as described in method 2019 of the JEDEC standard MIL-STD-883. The standard also describes the criteria for evaluation of the test.