BONDTESTERS

SOLDER BUMP SHEAR

Introduction

The basis of this method is the removal of a solder bump from a package using a chisel-like shear tool with a face width comparable in size to the diameter of the test ball. A wide variety of speeds can be used according to the application. Bond strength and failure mode can both be used to evaluate the test.

Shear bump testing is exceedingly easy to perform requiring a minimum level of operator skill.

Standard

Solder bump shear is covered by JEDEC standard JESD22-B117a (Gold wire bond ball shear is covered by JESD22-B116). Dage machines conform to and in some cases exceed these standards.

High speed

Evidence is accumulating that the high speed variation (>100mm/s, typically 1000mm/s) is an excellent method for the screening of brittle fracture failures, especially where lead-free materials are being used. It may also provide an alternative to board level drop testing. Force-versus-displacement profiles provide objective failure mode classification. Click on the link here for more details - DAGE 4000HS

Dage provides:

Testing at traditional speeds is available on the DAGE 4000 machine. A variety of work holders and load cells are available to satisfy all applications.

Automation options are available. For shear testing on wafers where semi-automatic handling is provided see DAGE 4000W and 4300.

Ball bonds on small geometry packages and devices are also tested by shear. The DAGE 5000 provides all the functions to test these types of bonds: cavity shear tools, anti-vibration fixtures, tool alignment, etc.

Ball clearance jig

This new addition to the Dage catalogue greatly facilitates sample preparation for use on the DAGE 4000HS. The machine can accommodate a wide variety of device sizes and ball diameters.