Wire Pull

Wire pull is a long established technique for testing the integrity of wire bonds on microelectronic packages. DAGE has been at the forefront of such testing since its inception.

Wire bonds are used to connect circuitry either within an electronic package or on to metal lead frames. Different methods are used to form the wires such as thermo-compression, ultrasonic and thermo-sonics.

Billions of wire bonds are formed each year in a total of 40 billion devices. Wire bonds can be divided into two types: wedge and ball bonds. Currently the latter predominates, but considerations of decreasing size and increasing functionality will probably lead to an increasing proportion of the narrower wedge bonds.

Although wire bonding is a mature technology with highly refined processes, bonds still need to be tested, and Dage provides machines and a range of accessories suitable for every type of wire bond.

See DAGE 4000 page for detailed specifications on the range of tests and accessories. A range of load cell cartridges suitable for all types of wire bonds are available. Again, see the machine specifications for details.

Geometries are continuing to get smaller in electronic packages and this includes the size and pitch of the wire bonds. DAGE recognises this trend and has developed the 5000 machine to accommodate small geometry testing. Special optics for tool alignment, together with anti-vibration measures and low range load cells mean that you can test the finest of geometries with confidence in the results. Click here for more details on the DAGE 5000 machine.

Automation possibilities are available on the standard DAGE 4000 machine. For testing on wafers, including semi-automatic handling of the wafers, see the pages on the DAGE 4000W and 4300 machines.

The principle behind basic wire bond testing is positioning of a hook underneath the wire and pulling in the Z axis either until the bond breaks (destructive testing) or a predefined force is reached (non-destructive testing). Wire bond testing is covered by the external standard MIL-STD-883 (Methods 2011.7 for destructive testing and 2023.5 for non-destructive). DAGE machines fully conform to or exceed these standards. The standards contain specifications for acceptance or rejection criteria.

DAGE also provides facilities to test other aspects of wire bonds: ball bond shear – DAGE 5000 (small geometry testing); Vectored pull on CSP packages (4000 with modifications).