Welcome to the Dage Group
Forty years of putting the customer at the centre of its strategy have led to the Dage Group being firmly and successfully established in the electronics market.
Dage have developed a wide range of capabilities and solutions that are further enhanced by designing and developing many of the core technologies that underpin its products.
Whatever the type of device or bonding, DAGE provides market-leading and award-winning solutions to your bondtesting needs.
What type of bonds are you testing?
Select an option that suits you:
- Wire pull
- Solder bump pull
- Solder bump shear
- Wafer handling option (pull & shear)
- Zone Ball shear & Die Shear
- High Speed shear and pull testing
Systems: 4000 , 4000HS, 5000, 4000W, 4300
Can we help you?
Answers to those FAQs
View Technical Papers
Dage x-ray systems have been specifically and ergonomically designed for the circuit board (PCB) and semiconductor industries.
High Resolution Micro-focus X-ray Inspection systems for the most demanding X-ray tasks
- XiDAT Digital X-ray Ultra High Resolution
- XiDAT Digital X-ray Sub-Micron
- XIDAT Large Format Digital X-ray
- 3D CT
Systems: 7600NT , 7500VR, 7500NT,
3D CT, 7800,
Can we help you?
Answers to those FAQs
View Technical Papers
Dage News
Defect Of The Month
Wicking of BGA Solder Balls
If the BGA solder balls have not been deliberately designed to wet, or wick, away from the pad as part of a reflow indicator, then poor mask design or a damaged, solder mask can cause the solder to wet away down the track during reflow. To read the full article, please click here
