The Industry's First Ultra Fine Pitch Bondtester

Dage Precision Industries introduces the Series 5000 Bondtester specifically designed to meet the demands of testing ultra fine pitch (UFP) wire bonded devices.

The Series 5000 is capable of testing bonds at pitches of 50 micron pitch and below. An evolutionary advance from Dage?s industry leading Series 4000 Bondtester, the Series 5000 will include a number of major advances such as leading edge optical systems to help the operators align and grade the bonds, ultra low force transducer systems and unique shear and pull tooling to minimize lead and ball damage.

The 5000 Bondtester is the first of its type to specifically address the demands of UFP device bond testing including shear and pull test at pitches or 50 microns or less.