Dage Introduces New XD7600NT100 Digital X-ray Inspection System at APEX 2009
X-ray Integrated Digital Acquisition Technology
The most technologically advanced X-ray system on the market
Dage Precision Industries, a Nordson company (NASDAQ: NDSN) and the industry leader in x-ray inspection technology, is pleased to announce the introduction of its new XD7600NT100 digital x-ray inspection system. This revolutionary new system will be exhibited for the first time in North America at the IPC Printed Circuits Expo and APEX Designers Summit scheduled to take place on March 31 to April 2, 2009.
The new XD7600NT100 is the most technologically advanced x-ray inspection system on the market today with groundbreaking 100 nanometer (0.1 micron) feature recognition for finite analysis of the most challenging inspection applications. Equipped with a 2M pixel imaging system, the XD7600NT100 offers oblique angle viewing of up to 70-degrees in any position around any point of a 16”x18” (407x458mm) inspection area without compromising system magnification.
The XD7600NT100 combines the superior digital acquisition technology of the Dage XiDAT 2.0 imaging system with Dage’s award winning and easy to use ImageWizard software for world class inspection quality. It is configured with dual monitors allowing operators to view the all important x-ray image on a 24” widescreen LCD monitor while at the same time allowing a highly detailed, full screen display of the navigation map on a 20” flat panel LCD display. The system is available with a high-power tube combining 10 watts of power and sub-micron feature recognition. Unlike existing high power tubes that have to significantly compromise resolution when used at higher power levels, this new Dage high-power tube retains sub-micron feature recognition at full power.
Optionally, the XD7600NT100 can be equipped with computerized tomography (CT) providing 3D modeling and volumetric measurement of solder joints, ideally suited for analytical analysis of solder interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package.