Dage Group

The Dage group, founded in 1961, is a market leader in its chosen markets of Semiconductor and PCBA Manufacture.

The strong Management Team has targeted and achieved high-growth within its selected market segments whilst at the same time achieving excellent profitability. Innovation, product development and cost effective solutions for its Customers have been the key factors in its continuing success.

The Group Headquarters are conveniently located in Aylesbury, UK, about 60 Km north from London.

Dage Holdings Limited
25 Faraday Road, Rabans Lane Industrial Area
Aylesbury. Buckinghamshire HP19 8RY UK
Tel: +44 (0) 1296 317800/Fax +44 (0) 1296 317801

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Dage Precision Industries Ltd 

This innovative division of The Dage Group has a strong portfolio of products for destructive and non-destructive mechanical testing and inspection of electronic components. It has an excellent, wholly owned distribution and support network of seven offices covering Europe, Japan, China, Singapore, and the USA, and maintains representative offices in other territories.

With its self-contained R&D facilities, DPI has developed world-leading products for testing wire bonds on semiconductor packages such as BGAs, Chip Scale Packages (CSP) and other electronic components. More recently DPI has been heavily involved in the testing of the newest technology 300 mm wafer bump shear.

Following the acquisition of an X-ray tube manufacturer, DPI developed an excellent suite of X-ray inspection equipment targeted at both the Semiconductor and PCBA markets.

Control of the patented core technology of X-ray tube manufacture ensures that the high-resolution X-ray will detect, identify and measure even the smallest of features. DPI's high precision, state-of-the-art inspection equipment when joined with their sophisticated software offerings, ensure that the equipment is simple to use.

DPI and the Dage Group operate with the same core strategy:

• To support our customers wherever they do business,
• To continually develop new products that provide its customers with enhanced competitive advantages,
• To develop products which bring new advantages to its customer base and,
• To control the core technologies that underpin its products.