Dage To Exhibit Enhanced High-Speed Bondtester Toolset At IMAPS 2008

Offers brittle fracture failure detection and cold bump pull capability

Dage Precision Industries, a Nordson company (NASDAQ: NDSN) and the industry leader in bondtesting technology, will showcase its newest bond test developments in Booth 304 at the IMAPS 2008 International Symposium on Microelectronics scheduled to take place on November 2-5, 2008 at the Rhode Island Convention Center in Providence, Rhode Island. 

High strain rate bondtesting using the Dage 4000HS High-Speed Bondtester has become an established technique for detecting brittle fracture failures in lead-free materials.  Dage’s new 4000HS software and hardware toolset offers even more capability for bondtesting analysis and process control.  This toolset includes the new high-speed trigger capture software and new rising table work holder for cold bump pull bondtesting.  These new toolset features further enhance the application of high-speed bondtesting, a technology pioneered by Dage.

Conventional force measurement provides poor discrimination between different failure modes, but bond failure energy measurements give the possibility of detecting subtle differences between solder materials, bump metallization, and process parameter changes.  Using energy as a metric, high strain rate bondtesting becomes a production monitor.  The basis for energy measurements are force-displacement curves generated for each test.  Bands of values can be assigned to particular failure modes and correlated with the same failure modes in board level drop testing. 

The Dage 4000HS High-Speed Bondtester is the only test instrument on the market today that provides energy measurements during bondtesting and assures full compliance with JEDEC standards and offers world class analysis of microelectronic solder joint integrity and reliability.