Dage 4000HS High-Speed Bondtester Complies With New JEDEC Standards

Dage Precision Industries, a Nordson company (NASDAQ: NDSN) and the industry leader in bondtesting technology, is pleased to announce that it’s 4000HS High-Speed Bondtester is the first such test instrument to fully comply with the recently published JEDEC standards for high-speed bondtesting.

As semiconductor packages continue to move to 3D packaging such as package-in-package (PiP), package-on-package (PoP) and system-in-package (SiP) these 3D packages typically contain more bumped devices.  At the same time, the increased use of lead-free solder in portable products makes them susceptible to brittle fracture failures at the solder ball to pad interface when subjected to mechanical shock.  High-speed bondtesting including high-speed solder ball shear and pull testing has proven to be a reliable indicator of drop test performance without the expense or ambiguous results typical with drop testing.

The award winning Dage 4000HS High-Speed Bondtester now offers enhanced cold bump pull (CBP) bondtesting capability which provides several advantages over conventional shear testing.  The load is symmetrical and almost pure tensile, there is less deformation ensuring load application over the entire bond interface, and the loading closely mimics that of drop testing on corner solder balls.  With this new 2nd generation high-speed CBP, all the features of high-speed shear testing provided by the Dage 4000HS are present, including digital data capture from high bandwidth transducers yielding force-displacement graphs and energy values.  These can be used to easily discriminate between different failure modes, eliminating subjective evaluation.

Dage continues to push the boundaries of high-speed shear and high-speed pull bond testing and further develop this new test methodology.  This includes the ability to handle ever smaller solder ball geometries and to improve the data capture and analysis using energy as a failure criterion.  The Dage 4000HS with 2nd generation CBP capability is the only test instrument on the market today that assures full compliance with JEDEC standards and offers world class analysis of microelectronic solder joint integrity and reliability.