Dage’s David Bernard to present at SMTA International

Highly informative technical paper on package-on-package (PoP) inspection

Dage Precision Industries, a Nordson company (NASDAQ: NDSN) and the industry leader in digital X-ray inspection technology, is pleased to announce that David Bernard, product manager X-ray systems, will participate in the technical conference of the upcoming SMTA International scheduled to take place on October 4-8, 2009 at the Town & Country Resort Convention Centre in San Diego, California.

Dr. Bernard will present a technical paper entitled, “The Challenges of Package-on-Package (PoP) Devices during Assembly and Inspection.”  In his role, David has gained worldwide recognition for demonstrating, training and problem solving using X-ray inspection systems throughout the electronics assembly industry.  David will be joined by international consultant Bob Willis, a lead-free auditor and workshop instructor, in conducting this highly informative presentation.

This technical paper outlines the processes associated with soldering stacked packages using dip flux and dip solder paste that are specifically designed to overcome the incidence of package warpage.  Based on real-world process issues, inspection results will be presented to better illustrate the challenges in implementing stacked packages into production.

Dr. Bernard will also be staffing the Dage booth at the SMTA International exhibition (Booth 703) where he will offer free and unbiased technical advice to help visitors with process problems and field failure analysis.  Visitors are encouraged to bring their board assemblies for discussion and review as well as real-world, live examination to better understand the process problem and suggested solutions.